Featured Tech Articles

  • VIDEO: Rapid Prototyping with mbed

    Posted May 25, 2013 By NXP
    mbed is a rapid prototyping platform for microcontrollers, that has been spearheaded by ARM and NXP in partnership since its inception.
  • Power Supply Design Techniques

    Posted May 25, 2013 By Power Integrations
    Offline switching power supplies have high voltage and high current switching waveforms that generate Electromagnetic Interference (EMI) in the form of both conducted and radiated emissions. Consequently, all off-line power supplies must be designed to attenuate or suppress EMI emissions below commonly acceptable limits. This application note presents design techniques that reduce conducted EMI...
  • Highly Efficient Low On-State Voltage IGBTs

    Posted May 24, 2013 By IXYS
    New IGBT product line at Design West.
  • Infusion Pump and Portable Medical Designs—Important Considerations

    Posted May 24, 2013 By Maxim
    Abstract: This tutorial discusses critical considerations requiring attention when designing an infusion pump, including FDA regulation, self-test circuitry, and meeting the IEC 60601-1 standard for electrical medical equipment. It also provides summary coverage of pump mechanisms, power-on self-test (POST), designing for low power and portability, timekeeping, alarms, and electrostatic-discharge...
  • First-Time Setup of the BeagleBone Black

    Posted May 24, 2013 By Mouser
    We take you through initial set-up of the BeagleBone Black, beagleboard.org's NEW high-power and low-cost development platform! Learn more at http://www.mouser.com/beagleboneblack
  • Distributed Base Stations

    Posted May 24, 2013 By Littelfuse
    The most popular type of Wireless Base Station deployment (cell site) consists of a Base Transceiver Station (BTS) located in close proximity to the antenna tower. This BTS connects to both the Mobile Switching Center (MSC), which directs hand-off between towers for mobile users, and the Radio Frequency (RF) transmitters/receivers antenna located on the tower structure. The “hut” at the...
  • Notes on Mounting and Soldering

    Posted May 23, 2013 By AKM Semiconductor
    Soldering conditions for individual products depend on factors such as package, printed circuit board, soldering method and the equipment used. This note will provide you a quick overview of the mounting and soldering proces being done by Asahi Kasei Microdevices Corporation.
  • Latest Material and Construction Methods for High Quality Rigid-Flex PCB’s

    Posted May 23, 2013 By Epec Engineered Technologies
    The demand for portable electronics keeps increasing, and there is a need to produce more compact devices with ever-increasing capabilities. Engineering solutions that combine functionality with flexibility are called for in aerospace, medical, and military applications.

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