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CTS Electronic Components

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CTS Heat Sinks with Low Thermal Resistance

h2. While Attachment Method Provides Optimal Convenience

CTS Electronic Components, Incorporated announces a full line of heat sink products that are convenient and easy to use, while maintaining an exceptional thermal performance. These heat sinks are applicable for BGA, PGA, PLCC, QFP and other IC packages.

Forged Heat Sink Series is a set of low profile, thin fin heat sinks. Its height ranges from 6.3mm to 32.6mm with thermal resistance as low as 1.9°C/Watt @ 200 LFPM convection flow conditions. These heat sinks attach to the integrated circuit via an adhesive tape or clip,
whichever is appropriate for the application. As a result, they are easy to handle and require no special tools to assemble on the IC packages or additional holes on the PCB. CTS’ line of forged heat sinks, AER, APF, and APR series, are ideal for large ICs with heat dissipation needs.

AER, APF, and APR series Forged Heat Sink

AER, APF, and APR series Forged Heat Sink

Extruded Heat Sink Series has a pre-applied adhesive tape that peels off and sticks onto the component. This attachment method reduces assembly cost and there are no messy adhesives or greases required. The adhesive shear strength at 100°C is 36 psi – a one inch square heat sink would require a 36 lb. force to remove heat sink. Thermal resistance for this product as low as 2.6°C/Watt @ 400 LFPM forced convection flow conditions. CTS’ BDN series is a cost effective alternative compared to conventional heat sinks.

BDN series Extruded Heat Sink

BDN series Extruded Heat Sink

“Design engineers need effective solutions for the dissipation of heat from high performance integrated circuits,” says Terry Luxmore, Director of Thermal Products for CTS. “CTS’ full array of heat sinks meet a wide range of thermal resistance demands with minimal assembly cost and complexity.” For examples of real world applications, see Avnet’s ZedBoard program where CTS heat sinks have been chosen for reference designs available at http://www.zedboard.org.

For more information on the AER, APF, and APR Series and BDN Series and other heat sinks that offer cost effective solutions in both standard and customized configurations, please contact your local CTS Sales Representative or supporting CTS Inside Sales Representative or visit http://www.ctscorp.com/components or call 630-577-8857.

Tags: heat sink, fin, forged, extruded, adhesive, LFPM, dissipate, thermal

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