2012 IEEE 62nd ECTC
Tuesday, May 29th through Friday, Jun 01st, 2012 - San Diego, California
Event Details
The technical program contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, optoelectronics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies. Both poster and presentation formats are Used. Special papers presented at the ECTC will be awarded the Intel Best Student Paper Award and best and outstanding paper awards. Committee Information
The Professional Development Courses offer state-of-the-art technology reviews and updates in a condensed half-day format. Topics cover a wide range of technologies.
Event Location
Sheraton San Diego Hotel and Marina
San Diego, California
United States
Event Date
Tuesday, May 29th through Friday, Jun 01st, 2012
