Automotive-Grade TrenchMOS

NXP is making a significant expansion to its automotive MOSFET product portfolio. Its new automotive grade-technology, Trench 6, brings new levels of performance and manufacturing excellence to an already comprehensive base. With an initial product release in the industry-standard D2PAK the Trench 6 portfolio will be rolled out into all key automotive packages including NXP’s high performance, high reliability LFPAK56 Power-SO8 package. The new technology platform covers all key voltage grades: 30 V, 40 V, 60 V, 80 V & 100V with both standard and logic level gate drive variants available for every product.

Key features and benefits

• AEC-Q101 automotive grade products rated at 175 ºC across the range
• Industry benchmark low on-resistance and current handling performance
• High performance switching capability for high frequency applications
• Simple, robust, avalanche rugged technology structure
• Highest quality and reliability proven through extended life testing
• Widest range of products for application flexibility and customer choice
• Dual source wafer manufacturing for supply chain risk reduction
• Proven packaging and silicon technology – designed with automotive zero defects in mind
• Comprehensive technical support information for easy design-in