Automotive-Grade TrenchMOS


NXP is making a significant expansion to its automotive MOSFET product portfolio. Its new automotive grade-technology, Trench 6, brings new levels of performance and manufacturing excellence to an already comprehensive base. With an initial product release in the industry-standard D2PAK the Trench 6 portfolio will be rolled out into all key automotive packages including NXP’s high performance, high reliability LFPAK56 Power-SO8 package. The new technology platform covers all key voltage grades: 30 V, 40 V, 60 V, 80 V & 100V with both standard and logic level gate drive variants available for every product.

Key features and benefits

  • AEC-Q101 automotive grade products rated at 175 ºC across the range
  • Industry benchmark low on-resistance and current handling performance
  • High performance switching capability for high frequency applications
  • Simple, robust, avalanche rugged technology structure
  • Highest quality and reliability proven through extended life testing
  • Widest range of products for application flexibility and customer choice
  • Dual source wafer manufacturing for supply chain risk reduction
  • Proven packaging and silicon technology – designed with automotive zero defects in mind
  • Comprehensive technical support information for easy design-in
Article Sources: NXP Semiconductors

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