Electronic Design News

Lowest Cost Printed Circuit Board

Caledon Controls Ltd. has through a collaborative effort between them, Vast Films and Triangle Labs created the world’s least expensive interconnect structure (PCB). They announced recently.

By using PDIM (Pre-Deposited Images in Metal) technology as supplied by Caledon and Vast Films, Triangle Labs successfully developed a process using some of their proprietary technology to copper electroplate PDIM film.

Triangle Research’s Bob Grey confirmed that PDIM supplied with a copper seed image...

Low-Loss, High-Speed PCB Laminate

Isola Group S.a.r.l., a leading global material sciences company that designs, develops, manufactures and markets copper-clad laminates and dielectric prepreg materials used to fabricate advanced multi-layer printed circuit boards, today announced the successful completion of the beta site testing and internal qualification for I-Speed™, the Company’s next generation lead-free compatible, low-loss, high-speed digital laminate product.

I-Speed joins Isola’s UL family of High Speed...

28+ Gbps Mezzanine Connector

Molex Incorporated has launched a new modular NeoScale™ mezzanine interconnect system capable of achieving optimal signal integrity at data rates of 28+ Gbps. Designed for printed circuit board (PCB) mezzanine applications in enterprise networking towers and telecommunication hubs and servers, in addition to industrial controllers and medical and military high data-rate scanning equipment, the NeoScale mezzanine interconnect features a patent-pending triad wafer configuration that isolates...

SMT Board-to-Board Connectors

Molex Incorporated introduces SlimStack™ B8 connectors, featuring a robust housing and unique CleanPoint™ contact for removing flux and other contaminants to provide superior electrical reliability. Compact SlimStack B8 0.40mm pitch SMT board-to-board connectors, with a 0.80mm height and ultra-narrow 2.50mm width, afford maximum space savings in high end medical, consumer electronics and data/telecom mobile device applications.

“In the production process of flex-to-board jumpers, flux...

End-to-End 25 Gbps Connector

Supporting next-generation 100 Gbps Ethernet and 100 Gbps InfiniBand* Enhanced Data Rate (EDR) applications, Molex Incorporated offers a comprehensive portfolio of industry-leading end-to-end high-speed channel solutions for increased data rates with minimal crosstalk and maximum signal integrity in mobile telecom and data communications storage and networking applications.

“Today’s customers need faster and denser systems that will meet the demands of tomorrow’s bandwidth hungry...

Signaling IC extend FR-4 to 10-Gbps

Texas Instruments Incorporated introduced 10 signal conditioners designed to drive high-speed interface standards such as 10G/40G/100G Ethernet, 10G-KR (802.3ap), InfiniBand, Fibre Channel and CPRI. The new integrated circuits (ICs) join a comprehensive family of repeaters and retimers that combat signal impairments caused by insertion loss, jitter, reflections and crosstalk in high-speed enterprise servers, routers and switches. Manufactured using TI’s high-performance BiCMOS SiGe process...

High Mating Cycle Crimp Terminals

Molex Incorporated introduces the Mini-Fit® Plus HMC (High Mating Cycle) crimp terminals, ideal for applications that require a high number of mating cycles including medical devices, consumer appliances, networking and telecommunications equipment and power supplies. The female crimp terminals are rated up to 1,500 mating cycles and are capable of up to13.0A per circuit. The patented, elongated dimple design provides longer length and greater contact area when compared to the standard...

Interconnect Solution for 25 Gbps

The Molex Incorporated enhanced zSFP+ (Small Form-factor Pluggable Plus) SMT (Surface Mount Technology) 20-circuit connectors deliver superior performance in high-speed telecom and data communications equipment. Designed for 25 Gbps serial channels in high-speed Ethernet and Fibre Channel, the new zSFP+ interconnect assemblies are scalable for next-generation applications and provide optimal electromagnetic interference (EMI) and signal integrity (SI) margins in 10 and 16 Gbps channels.