Altera Corporation, an Intel-owned American manufacturer, recommends using automated pick-and-place machines in an ESD-protected environment to transfer QFP or BGA devices between trays. The figure above shows how you can transfer a QFP device with a vacuum pen.
If you are required to transfer these devices manually, follow these guidelines:
- Work in an ESD-protected environment.
- Use ground straps and finger cots.
- Use only vacuum pens to transfer QFP or BGA devices manually. Vacuum pens must be able to maintain their vacuum for at least four seconds.
- Transfer devices right-side-up over a table, then release the vacuum only after the device is oriented and seated in the tray properly.
- Do not allow QFP device leads to contact the tray.
For transferring lidless FBGA devices, follow these guidelines:
- Ensure that you use vacuum pens with soft rubber tips.
- Ensure that the vacuum pen does not touch the edge of the exposed die.
- Ensure that the vacuum tip covers the die area without losing any suction.
- Altera recommends that you use Altera-specified trays for lidless flip chip.