Transferring QFP, BGA, FBGA, and Lidless FBGA Devices Without Carriers Between Trays

Transferring QFP, BGA, FBGA, and Lidless FBGA Devices Without Carriers Between Trays

 

Altera Corporation, an Intel-owned American manufacturer, recommends using automated pick-and-place machines in an ESD-protected environment to transfer QFP or BGA devices between trays. The figure above shows how you can transfer a QFP device with a vacuum pen.

If you are required to transfer these devices manually, follow these guidelines:

  • Work in an ESD-protected environment.
  • Use ground straps and finger cots.
  • Use only vacuum pens to transfer QFP or BGA devices manually. Vacuum pens must be able to maintain their vacuum for at least four seconds.
  • Transfer devices right-side-up over a table, then release the vacuum only after the device is oriented and seated in the tray properly.
  • Do not allow QFP device leads to contact the tray.

For transferring lidless FBGA devices, follow these guidelines:

  • Ensure that you use vacuum pens with soft rubber tips.
  • Ensure that the vacuum pen does not touch the edge of the exposed die.
  • Ensure that the vacuum tip covers the die area without losing any suction.
  • Altera recommends that you use Altera-specified trays for lidless flip chip.
Sources: Altera

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