Fast Curing Adhesive Has High Thermal Conductivity
Master Bond has formulated EP24AN, a fast curing two component epoxy adhesive with an exceptionally high thermal conductivity. Its thermal conductivity is over 22 BTU•in/ft^2•hr•°F. EP24AN also has superior electrical insulation properties with a volume resistivity of > 10^13 ohm-cm.
This easy to use material has a 1 to 1 non-critical mix ratio weight or volume. It has excellent adhesion to a wide range of similar and dissimilar substrates and can offer a tensile shear strength of over 1,600 psi. EP24AN has an extremely fast cure time at room temperature. Gel times can be obtained in 20 minutes.
The Master Bond EP24AN has a low coefficient of thermal expansion, low shrinkage and superb dimensional stability. It has outstanding thermal shock and chemical resistance. EP24AN is available in 1/2 pint, pint, quart, gallon and 5 gallon kits.